METHOD OF DEPOSITING PIEZOELECTRIC FILM AND PIEZOELECTRIC ELEMENT USING IT

• Main Author: MURASHIMA YUJI
• Format: Patent
• Language: English
• Published: 05.01.2012
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To enhance the characteristics and reliability of an element using a piezoelectric substance.SOLUTION: A space where a pair of targets are facing each other is provided in a vacuum chamber, a substrate and a lead supply source are installed substantially perpendicularly to the facing direction of the targets, and then a magnetic field is generated along the facing direction and a voltage is applied to the target so that plasma is generated thus forming a piezoelectric film on the substrate. When the piezoelectric film is formed, lead vapor is supplied from the lead supply source to the space where the targets are facing each other, and the pressure in the vacuum chamber is set equal to or lower than 0.13 Pa. With such arrangement, ferroelectric characteristics, piezoelectric characteristics, pyroelectric characteristics and reliability are enhanced.