ADHESIVE FILM FOR SEMICONDUCTOR, WIRING BOARD FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND ADHESIVE COMPOSITION

PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor such that warpage due to a thermal history in manufacture of a semiconductor device is suppressed.SOLUTION: The adhesive film for the semiconductor includes a base film, a first epoxy resin which is provided on the base film and h...

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Bibliographic Details
Main Authors GO YUTAKA, INADA TEIICHI, IWAKURA TETSUO, MORIMOTO TAKESHI
Format Patent
LanguageEnglish
Published 05.01.2012
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor such that warpage due to a thermal history in manufacture of a semiconductor device is suppressed.SOLUTION: The adhesive film for the semiconductor includes a base film, a first epoxy resin which is provided on the base film and has a three-point bending elastic modulus of less than 50 g/mm at 20°C after heat curing, a second epoxy resin which has a three-point bending elastic modulus of equal to or larger than 50 g/mm at 20°C after heat curing and an epoxy equivalent of 100 g/eq to 250 g/eq, and is solid at 20°C, a curing agent, and an adhesive composition layer including a (meth)acrylic copolymer.
Bibliography:Application Number: JP20100138487