LAMINATE OF SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a laminate of semiconductor modules in which delamination of mating surfaces due to difference of thermal expansion is prevented, attachment of the laminate of semiconductor modules is facilitated, and sealed state of the mating surfaces can be sustained for long ter...

Full description

Saved in:
Bibliographic Details
Main Authors NORITAKE CHIKAGE, NAKAMURA MASAYA
Format Patent
LanguageEnglish
Published 05.01.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a laminate of semiconductor modules in which delamination of mating surfaces due to difference of thermal expansion is prevented, attachment of the laminate of semiconductor modules is facilitated, and sealed state of the mating surfaces can be sustained for long term use.SOLUTION: The laminate 1 of semiconductor modules 2 is formed by laminating a plurality of the semiconductor modules 2 produced by molding semiconductor elements 3 by mold resin 4. A refrigerant channel 41 is formed in the mold resin 4 in order to feed a refrigerant C that cools the semiconductor elements 3. A bonding material 61 provided on mating surfaces 42 is adhered with the mold resin 4; thereby the plurality of the semiconductor modules 2 are laminated, thus forming the laminate 1.
Bibliography:Application Number: JP20100138228