LAMINATED WORKPIECE SEGMENTATION SYSTEM AND LAMINATED WORKPIECE SEGMENTATION METHOD

• Main Authors: SUGISHITA HIROSHI, NIKI MASAYUKI, KASE MITSUO, AMI MASAAKI
• Format: Patent
• Language: English
• Published: 22.12.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; SEMICONDUCTOR DEVICES; SHOP CONVEYOR SYSTEMS; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a laminated workpiece segmentation system and a laminated workpiece segmentation method capable of continuously cutting out thin workpieces one by one with a predetermined pressing force from a laminated workpiece with a sticking force being reduced by separation enhancement to smoothly convey the thin workpieces.SOLUTION: A laminated workpiece segmentation system comprises: a separation tank 20 which enhances the separation of a laminated workpiece; a segmentation device 30 in which a segmentation conveyor cuts out an uppermost workpiece of the laminated workpiece while enhancing the separation of the laminated workpiece; a multiple workpiece feeding prevention device 40 which prevents the passage of two or more workpieces; a workpiece vibration conveying device 50 which chips a cracked corner portion by conveying the workpiece while vibrating it; a chipped workpiece identification device 60 which detects the chipped corner portion of the workpiece being conveyed; a workpiece sorting device 70 which passes a non-defective workpiece to the downstream side and collects the chipped workpiece; and a workpiece housing device 80 which houses the non-defective workpiece. This invention also provides a laminated workpiece segmentation method using this system.