PHOTOSENSITIVE COMPOSITION FOR FORMING INSULATING FILM

• Main Authors: ISHIKAWA KIYOSHI, MASUJIMA MASAHIRO, SHIMATANI SATOSHI
• Format: Patent
• Language: English
• Published: 22.12.2011
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a photosensitive composition for forming an insulating film which is capable of reducing a dielectric constant of a formed insulating film.SOLUTION: A photosensitive composition for forming an insulating film, which comprises a silsesquioxane resin(A) having a structural unit(a1) represented by the following general formula(I) and a structural unit(a2) represented by the following general formula(II), an acid generator component(B) that generates an acid by exposure, and a crosslinker component(C), is used. In the following general formula(I), Ris an alkylene group having 1-5 carbon atoms, and n is an integer of 1-5. In the following general formula(II), Ris an alkyl group having 1-10 carbon atoms.