MANUFACTURING METHOD OF PACKAGE, MANUFACTURING METHOD OF PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIO-CONTROLLED WATCH

• Main Author: FUNABIKI YOICHI
• Format: Patent
• Language: English
• Published: 08.12.2011
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To prevent a void from generation in a through electrode.SOLUTION: A manufacturing method of a package capable of encapsulating an electronic component within a cavity formed between a plurality of substrates joined each other includes a through electrode formation process forming a through electrode which penetrates a first substrate 40 along a thickness direction among a plurality of substrates, inside of the cavity and outside of the package. The through electrode formation process comprises: a recess formation process forming recessed parts 30 and 31 in the first substrate 40; a conductive member arrangement process arranging a conductive member 9 in the recessed parts 30 and 31; a filling process filling the recessed parts 30 and 31 around the conductive member 9 with a filler 6a; and a desiccation process drying the filler 6a. A supersonic wave S is applied to the filler 6a during the filling process or between the filling process and the desiccation process.