APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: HANAGURUMA TAKAKI, IIKURA TAKESHI
• Format: Patent
• Language: English
• Published: 01.12.2011
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing semiconductor device that includes a unit for uniformizing the jetting direction of a plating solution and also increasing a flow rate (pressure) of the plating solution from a jetting nozzle without imposing a load on a pump.SOLUTION: The apparatus for manufacturing semiconductor device includes: a plating treatment tank 1; a wafer support 3; a plating solution jetting nozzle base piping 12; and multiple plating solution jetting nozzles 13 for jetting the plating solution toward a work surface of a wafer 2. Each nozzle of the multiple plating solution jetting nozzles 13 is a nozzle having a venturi structure. A part of the plating solution jetting from the plating solution jetting nozzles 13 flows from an upper part to a bottom of the plating treatment tank 1, and meets the plating solution jetting from the plating solution jetting nozzles 13 so as to be jetted again toward the work surface of the wafer 2.