THERMOPLASTIC ELASTOMER COMPOSITION AND HEAT-CONDUCTIVE SHEET

PROBLEM TO BE SOLVED: To provide a thermoplastic elastomer composition capable of manufacturing a molded article being excellent in flexibility, heat resistance, cold-resistance, thermal conductivity, close adhesion property, rework property and recycle property and not generating a siloxane vapor.S...

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Bibliographic Details
Main Authors TOYODA NOBUYUKI, ONO NORIYOSHI, NAKANISHI HIDEO, KANAE KENTARO
Format Patent
LanguageEnglish
Published 24.11.2011
Subjects
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide a thermoplastic elastomer composition capable of manufacturing a molded article being excellent in flexibility, heat resistance, cold-resistance, thermal conductivity, close adhesion property, rework property and recycle property and not generating a siloxane vapor.SOLUTION: The thermoplastic elastomer composition contains 100 pts.mass of a hydrogenated diene-based copolymer (A) in which a block copolymer of a polymer block having a vinyl bonding content of less than 25% and a polymer block having a vinyl bonding content of 40% or more is hydrogenated, a hydrogenation ratio of a double bond originated in a conjugated diene is 80% or more and a weight average molecular weight is 50,000-700,000; 5-1,000 pts.mass of at least one liquid-like component (B) selected from the group consisting of a softener, a plasticizer, a lubricant and a liquid-like polymer; and heat-conductive filler (C).
Bibliography:Application Number: JP20100110370