POLISHING PAD AND POLISHING DEVICE USING THE SAME

• Main Authors: KAWACHI TATSURO, SHIROYAMA ATSUSHI
• Format: Patent
• Language: English
• Published: 24.11.2011
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a polishing pad which can improve the circulation property of slurry, unifying the polishing capability over a polishing surface, and enhancing the flatness of a surface to be polished of a glass plate, and a polishing device using the same.SOLUTION: Network-like grooves 12 and a slurry supply hole 14 are formed on a polishing surface of a polishing pad 20. Four grooves 16 are formed on the polishing surface from its center to its outer periphery, and the polishing surface is radially divided into four areas. The polishing surface of this constitution can distribute the slurry uniformly over the polishing surface. Further, a center slurry feed hole 14a is formed at the center of a polishing pad 40, and peripheral slurry supply holes 14b are formed in the grooves 16. By forming a plurality of slurry supply holes in the polishing pad, and supplying the slurry through a plurality of slurry supply holes in a polishing device, the slurry can be uniformly distributed over the polishing surface.