MOUNTING ASSEMBLY APPARATUS FOR FPD AND MOUNTING ASSEMBLY METHOD

PROBLEM TO BE SOLVED: To prevent the reduction in productivity associated with a switching of a product type by allowing compatibility between a full pressure-bonding unit and a PCB unit, each having an especially long process time and a strong tendency to define an entire tact.SOLUTION: A mounting...

Full description

Saved in:
Bibliographic Details
Main Authors ONOSHIRO ATSUSHI, ICHIKAWA HISAYOSHI, DAIROKU NORIYUKI, KATO HARUYOSHI, HIWATARI SHOTARO
Format Patent
LanguageEnglish
Published 17.11.2011
Subjects
ADVERTISING
BASIC ELECTRIC ELEMENTS
CRYPTOGRAPHY
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
LABELS OR NAME-PLATES
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
SEALS
SEMICONDUCTOR DEVICES
SIGNS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To prevent the reduction in productivity associated with a switching of a product type by allowing compatibility between a full pressure-bonding unit and a PCB unit, each having an especially long process time and a strong tendency to define an entire tact.SOLUTION: A mounting assembly apparatus comprises a PCB unit 140 that is switchable between a PCB connecting unit and an OLB full pressure-bonding unit according to a design of a FPD panel P to be produced. The PCB unit 140 can be switched to a full pressure-bonding unit 130 by switching an operation mode. Accordingly, the reduction in productivity on switching a product type of the FPD panel P is prevented.
Bibliography:Application Number: JP20100105414