REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR, DICING TAPE INTEGRATED REAR-SURFACE FILM FOR SEMICONDUCTOR, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND FLIP-CHIP SEMICONDUCTOR DEVICE

• Main Authors: SHIGA GOSHI, TAKAMOTO HISAHIDE
• Format: Patent
• Language: English
• Published: 10.11.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a rear-surface film for a flip-chip semiconductor, a dicing tape integrated rear-surface film for a semiconductor, a manufacturing method of a semiconductor device, and a flip-chip semiconductor device that can suppress or prevent the warp of a semiconductor element which is mounted onto an adherend by flip chip connection.SOLUTION: A rear-surface film 2 for a flip-chip semiconductor to be provided for a rear surface of a semiconductor element which is mounted on an adherend by flip chip comprises a thermally curable resin, in which the content of the thermally curable resin to the total resin component of the rear-surface film 2 for a flip-chip semiconductor is 40 wt.% or more and 90 wt.% or less.