REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide a rear-surface film for a flip-chip semiconductor and a dicing tape integrated rear-surface film for semiconductor that can suppress or prevent the warp of a semiconductor element which is mounted onto an adherend by flip chip.SOLUTION: A rear-surface film for a flip...

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Bibliographic Details
Main Authors TAKAMOTO HISAHIDE, SHIGA GOSHI
Format Patent
LanguageEnglish
Published 10.11.2011
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide a rear-surface film for a flip-chip semiconductor and a dicing tape integrated rear-surface film for semiconductor that can suppress or prevent the warp of a semiconductor element which is mounted onto an adherend by flip chip.SOLUTION: A rear-surface film for a flip-chip semiconductor to be provided for a rear surface of a semiconductor element which is mounted on an adherend by flip chip has a tension storage elastic modulus at 23°C after thermal curing of 10 GPa or more and 50 GPa or less.
Bibliography:Application Number: JP20100096290