COMPOSITION FOR PROVISIONAL FIXATION, PROVISIONAL FIXATION MATERIAL, TREATMENT METHOD OF SUBSTRATE AND SEMICONDUCTOR ELEMENT

PROBLEM TO BE SOLVED: To provide a composition for provisional fixation, capable of forming provisional fixation materials having retention retaining substrates in a process where the high temperature load is applied, and having easily peelable property in a process where the substrates are peeled f...

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Main Authors MIYAMATSU TAKASHI, MORI TAKASHI, TAKAMATSU NOBUHIRO, TAKAHASHI SEIICHIRO, HIRO AKIHITO, KAWAGUCHI KAZUO, TAKAMURA HAZUKI, GOTO HIROFUMI, OKUDA RYUICHI
Format Patent
LanguageEnglish
Published 10.11.2011
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide a composition for provisional fixation, capable of forming provisional fixation materials having retention retaining substrates in a process where the high temperature load is applied, and having easily peelable property in a process where the substrates are peeled from supports.SOLUTION: There is provided a composition for provisional fixation, comprising (A) a polyethersulfone, (B) a viscosity-imparting agent such as a phenoxy resin, a polymer having a phenolic hydroxy group, a polymer having a pyrrolidone group and a polyalkylene glycol, and (C) a solvent.
Bibliography:Application Number: JP20110006127