THERMAL HEAD

• Main Authors: KOBAYASHI IWAO, OKAYAMA SHIN, HIROSE SHOJI
• Format: Patent
• Language: English
• Published: 10.11.2011
• Subjects: CORRECTION OF TYPOGRAPHICAL ERRORS; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; SELECTIVE PRINTING MECHANISMS; STAMPS; TRANSPORTING; TYPEWRITERS

PROBLEM TO BE SOLVED: To downsize a thermal head including printed wiring boards.SOLUTION: This thermal head X includes: a board 7; a plurality of heat generation parts 9 arranged on the board 7; electrode wires 21 which are formed on the board 7 and include strip-like parts extending along the arrangement direction of the plurality of heat generation parts 9, and in which the strip-like parts are electrically connected to the plurality of heat generation parts 9 in common; printed wiring boards 5 having printed wires connected to the electrode wires 21; and a conductive member 12 including a base part 12A extending along the strip-like parts of the electrode wires 21, and a holding part for collectively holding the board 7 and the strip-like parts of the electrode wires 21 by first contact parts 12B and a second contact part 12A arranged oppositely to each other; wherein the plurality of first contact parts 12B are arranged along the strip-like parts of the electrode wires 21 and come into contact with the strip-like parts of the electrode wires 21, and the more the distance on the electrode wire 21 from the connection part between the electrode wire 21 and the printed wire increases, the higher the arrangement density of the first contact parts 21B becomes.