ELECTROSTATIC CHUCK

• Main Authors: ITAKURA IKUO, KONDO SHUNPEI, ANADA KAZUTERU, UCHIMURA KENJI, HORI HIROAKI, ANAI YUKI
• Format: Patent
• Language: English
• Published: 04.11.2011
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERATION; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide an electrostatic chuck which restrains crack generation of a ceramic plate and which also allows quick heating and cooling of a substrate to be processed.SOLUTION: An electrostatic chuck comprises: a ceramic plate which has a recess on its principal plane and has an electrode inside; a temperature-adjusting plate connected to the ceramic plate; a first bond provided between the ceramic plate and the temperature-adjusting plate; a heater provided within the recess of the ceramic plate. The first bond has a base compound, formless fillers, and sphere-shaped fillers. The average diameter of the sphere-shaped fillers is larger than the maximum value among the breadths of all the formless fillers. The thickness of the first bond is the same as the average diameter of the sphere-shaped fillers or larger. The width of the recess is broader than the width of the heater, and the depth of the recess is deeper than the thickness of the heater. The heater is glued within the recess by a second bond. A first distance between the principal plane of the heater on the side of the temperature-adjusting plate and the principal plane of the temperature-adjusting plate is longer than a second distance between the principal plane of the ceramic plate and the principal plane of the temperature-adjusting plate.