METHOD OF MANUFACTURING WIRING BOARD

PROBLEM TO BE SOLVED: To suppress yield degradation in manufacturing a wiring board which has at least one conductor layer and one resin insulation layer each using a so-called damascene method where a wiring groove is formed in the resin insulation layer and the conductor layer is formed as a wirin...

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Bibliographic Details
Main Authors NISHIO KENJI, SATO HIRONORI, IZUMI MASARO, MURAMATSU MASAKI, HIGO ICHIEI, TORII TAKUYA
Format Patent
LanguageEnglish
Published 04.11.2011
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To suppress yield degradation in manufacturing a wiring board which has at least one conductor layer and one resin insulation layer each using a so-called damascene method where a wiring groove is formed in the resin insulation layer and the conductor layer is formed as a wiring layer in the wiring groove, by suppressing variation in processed shape and depth of the wiring groove and suppressing fluctuation in shape and thickness of the wiring layer formed in the wiring groove so that the wiring layer can have an impedance as designed.SOLUTION: In a wiring board containing at least one conductor layer and one resin insulation layer each, the resin insulation layer is surface-irradiated with laser to form a wiring groove in the resin insulation layer. Then, the conductor layer is formed in such a manner that at least a part of it is embedded in the wiring groove to form a wiring in the wiring groove.
Bibliography:Application Number: JP20100252691