SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a semiconductor device, along with a method for manufacturing the same, which is equipped with an electrical fuse for sure disconnection.SOLUTION: The electrical fuse has a lamination structure consisting of a polysilicon film 14 and a metal silicide film 15 such as...

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Bibliographic Details
Main Authors IWAMOTO TAKESHI, YONEZU TOSHIAKI
Format Patent
LanguageEnglish
Published 04.11.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device, along with a method for manufacturing the same, which is equipped with an electrical fuse for sure disconnection.SOLUTION: The electrical fuse has a lamination structure consisting of a polysilicon film 14 and a metal silicide film 15 such as tungsten silicide. By allowing a current of current density 40 mA/μmor higher to flow the electrical fuse of a predetermined length, the electrical fuse is surely disconnected by electromigration and pinch effect.
Bibliography:Application Number: JP20100089405