THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET

PROBLEM TO BE SOLVED: To provide a thermally conductive pressure-sensitive adhesive sheet which simultaneously satisfies a high thermal conductivity and high flexibility.SOLUTION: The thermally conductive pressure-sensitive adhesive sheet is obtained by applying a thermally conductive pressure-sensi...

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Bibliographic Details
Main Authors UEKI AYUMI, NAKAJIMA SATOSHI, FUKUHARA KUNIAKI
Format Patent
LanguageEnglish
Published 04.11.2011
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Summary:PROBLEM TO BE SOLVED: To provide a thermally conductive pressure-sensitive adhesive sheet which simultaneously satisfies a high thermal conductivity and high flexibility.SOLUTION: The thermally conductive pressure-sensitive adhesive sheet is obtained by applying a thermally conductive pressure-sensitive adhesive to one side or both sides of a film-like or sheet-like base material and forming in a sheet shape, or the thermally conductive pressure-sensitive adhesive sheet is obtained by forming the thermally conductive pressure-sensitive adhesive itself in a sheet shape. The thermally conductive pressure-sensitive adhesive contains 100 pts.mass of (A) a (meth)acrylic resin having a hydroxyl group in a functional group, 600-1,500 pts.mass of (B) a thermally conductive filler, and 1.5-60 pts.mass of (C) an elastic isocyanate-based crosslinking agent.
Bibliography:Application Number: JP20100086575