METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device, and to make the semiconductor device compact.SOLUTION: A method of manufacturing the semiconductor device includes: a step of supplying a supercritical fluid mixed with an under-fill material 24 into a high-pressure vessel in wh...

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Bibliographic Details
Main Authors IKEDA HIROAKI, OIDE HIROYUKI
Format Patent
LanguageEnglish
Published 27.10.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device, and to make the semiconductor device compact.SOLUTION: A method of manufacturing the semiconductor device includes: a step of supplying a supercritical fluid mixed with an under-fill material 24 into a high-pressure vessel in which a stacked unit 30 having a plurality of stacked semiconductor chips 22 is arranged; and a step of filling the under-fill material 24 in the space between the plurality of the semiconductor chips 22, by heating the stacked unit 30 placed in the high-pressure vessel and curing the under-fill material 24 infiltrated between the plurality of the semiconductor chips 22 by a polymerization reaction, while the supercritical fluid is being supplied.
Bibliography:Application Number: JP20100086030