SILICONE RESIN COMPOSITION, AND METHOD FOR ADHERING EPOXY RESIN COMPOSITION TO CURED SILICONE RESIN COMPOSITION

• Main Authors: KAMEDA MITSUTOSHI, OKUDAIRA HIROYUKI, SUGIURA AKIO, KATO KAZUO, KOZUKA KATSUSHI
• Format: Patent
• Language: English
• Published: 27.10.2011
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a silicone resin composition hardly causing a separation phenomenon in an adhesion interface when applying an adhesive such as an epoxy adhesive, and exhibiting good adhesion.SOLUTION: The silicone resin composition comprises: an organopolysiloxane compound having at least one epoxy group and at least one vinyl group respectively in the molecule; and a curable silicone composition. The silicone resin composition is cured by addition reaction, which uses a platinum group metal catalyst, between the vinyl group in the organopolysiloxane compound and a hydrosilyl group in the curable silicone composition. In a method of adhering an epoxy resin composition to the cured silicone resin composition, the epoxy resin composition (2) containing a curing agent is applied to the cured silicone resin compositions (1, 1'), and the curing agent in the epoxy resin composition (2) is reacted with epoxy groups in the cured silicone resin compositions (1, 1').