SEMICONDUCTOR LIGHT-RECEIVING ELEMENT AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor light-receiving element increased in yield by being stably manufactured while ensuring electric connection of an electrode with a semiconductor layer of the semiconductor light-receiving element, and to provide a method of manufacturing the same.SOLUT...

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Bibliographic Details
Main Authors WASHINO TAKASHI, SAKUMA YASUSHI, HAMADA HIROSHI
Format Patent
LanguageEnglish
Published 20.10.2011
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor light-receiving element increased in yield by being stably manufactured while ensuring electric connection of an electrode with a semiconductor layer of the semiconductor light-receiving element, and to provide a method of manufacturing the same.SOLUTION: The semiconductor light-receiving element includes a semiconductor substrate, the semiconductor layer laminated on the semiconductor substrate and having an upper surface part, a reflective film formed by covering the upper surface part of the semiconductor layer and having a reflection main region, and an upper electrode formed by covering at least a part of an upper surface of the reflective film and having a junction extending through the reflective film to come into contact with the upper surface part of the semiconductor layer. The semiconductor light-receiving element detects light incident from the side opposite to the semiconductor layer side of the semiconductor substrate, wherein the junction of the upper electrode surrounds a part of a peripheral edge of the reflection main region of the reflective film, and the reflection main region overlaps a region of the reflective film positioned on the outer side of the junction.
Bibliography:Application Number: JP20100075745