PRINTED CIRCUIT BOARD, PRINTED BOARD UNIT, AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a printed circuit board capable of preventing, with certainty, poor connection between a terminal pad and a terminal of an electronic device.SOLUTION: On a printed circuit board 17, specific areas 42a to 42d are specified at a rear side of an electronic component mou...

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Bibliographic Details
Main Authors SUGINO SHIGERU, NAKAMURA NAOKI, KANAI AKIRA
Format Patent
LanguageEnglish
Published 13.10.2011
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a printed circuit board capable of preventing, with certainty, poor connection between a terminal pad and a terminal of an electronic device.SOLUTION: On a printed circuit board 17, specific areas 42a to 42d are specified at a rear side of an electronic component mounting area that receives electronic components. In the specific areas 42a to 42d, a conductive film 39 is formed based on a ratio of the area of the surface of a substrate that is set as an electronic component mounting area and an area of a conductive material. The ratio of the area of the surface of a substrate 28 and the area of the conductive material 39 is adjusted for each electronic component by the electronic device mounting area and the specific areas 42a to 42d. As a result, the warpage of the printed circuit board 17 can be suppressed during heating in a reflow process.
Bibliography:Application Number: JP20110158156