METHOD OF MANUFACTURING PACKAGE, BLOCKING BODY, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT, AND RADIO-CONTROLLED TIMEPIECE

• Main Author: FUNABIKI YOICHI
• Format: Patent
• Language: English
• Published: 06.10.2011
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION OF NOISE BY SUCH CIRCUITS; GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To stably perform anodic bonding by preventing the occurrence of a discharge phenomenon when performing anodic bonding.SOLUTION: A method of manufacturing a package, wherein an electronic component can be sealed in a cavity between a first substrate 50 and a second substrate anodic-bonded to each other through a bonding film 35, includes: a recess formation step of forming a recess C1 for a cavity in a bonding surface 50a of the first substrate 50; a blocking body placement step of placing a blocking body 90 for blocking the recess C1 in the recess C1; a magnet placement step of placing a magnet 84, to which the blocking body 90 can be magnetically attached, on a surface 50b, opposite to the bonding surface 50a, of the first substrate 50; and a bonding film formation step of forming the bonding film 35 on the bonding surface 50a of the first substrate 50 after the blocking body placement step and the magnet placement step.