SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To obtain a semiconductor device that can secure a creeping distance between both front and rear electrodes of a semiconductor element without using a separate electrical insulation member and is suitable for connecting a heat sink by pressure contact on both front and rear fac...

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Bibliographic Details
Main Authors TEJIMA TAKANORI, MASAMITSU KUNIAKI, FUKUOKA DAISUKE
Format Patent
LanguageEnglish
Published 15.09.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To obtain a semiconductor device that can secure a creeping distance between both front and rear electrodes of a semiconductor element without using a separate electrical insulation member and is suitable for connecting a heat sink by pressure contact on both front and rear faces of the semiconductor element. SOLUTION: A semiconductor device includes: a plate semiconductor element 10 including a surface electrode 11 on the main surface side and a back electrode 12 at the rear side; and electrical insulation resin 20 that encompasses and seals the semiconductor element 10. The surface electrode 11 and the back electrode 12 are exposed on the outer surface of the resin 20. The resin 20 covers the entire side face of the semiconductor element 10 and has a shape that projects toward the direction in parallel to the main surface of the semiconductor element 10 from the side face. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20100097172