LASER BEAM CUTTING DEVICE AND LASER BEAM CUTTING METHOD

PROBLEM TO BE SOLVED: To provide a laser beam cutting device which is suitable for cutting a thick workpiece. SOLUTION: The device includes a nozzle 20 for cutting passing through a laser beam. The nozzle 20 for cutting includes: assist gas nozzles 21, 22 jetting assist gas for blowing off a melt wh...

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Bibliographic Details
Main Authors IKEDA GOJI, NAKAYAMA AKIYUKI, SHAMOTO HIDEYASU
Format Patent
LanguageEnglish
Published 15.09.2011
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide a laser beam cutting device which is suitable for cutting a thick workpiece. SOLUTION: The device includes a nozzle 20 for cutting passing through a laser beam. The nozzle 20 for cutting includes: assist gas nozzles 21, 22 jetting assist gas for blowing off a melt which has been melted by a laser beam; and a shield gas nozzle 23 jetting shield gas for protecting the assist gas. The assist gas nozzles 21, 22 have double nozzle structure made of an inside nozzle 21 and an outside nozzle 22. The inside nozzle 21 passes through a laser beam and further jets an oxygen-containing gas, and the outside nozzle 22 is arranged coaxially with the inside nozzle 21, and jets a high flow rate gas having a higher flow rate and a lower oxygen concentration compared with the oxygen-containing gas, and the assist gas is formed by the oxygen-containing gas and the high flow rate gas. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20110021760