METHOD OF MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE

• Main Author: FUNABIKI YOICHI
• Format: Patent
• Language: English
• Published: 08.09.2011
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION OF NOISE BY SUCH CIRCUITS; GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method of manufacturing a package capable of forming a penetration electrode without conduction defects while maintaining the airtightness of a cavity by suppressing the occurrence of voids in a baked glass, a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. SOLUTION: A package manufacturing method includes a second glass frit filling step S35A of filling a second glass frit 63 in a penetration hole 30 to be overlapped on a first glass frit 61 and temporarily drying the second glass frit; and a baking step S37 of baking and curing the first and second glass frits 61, 63 filled in the penetration hole. The second particle size of the second glass particles 63a contained in the second glass frit 63 is larger than the first particle size of the first glass particles 61a contained in the first glass frit 61. COPYRIGHT: (C)2011,JPO&INPIT