SUBSTRATE PROCESSING APPARATUS

• Main Author: TAKADA MASATOSHI
• Format: Patent
• Language: English
• Published: 08.09.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To prevent the occurrence of an adverse effect, such as slip and warpage of a wafer, caused by a wafer holder. SOLUTION: Multistages of wafer holders 70 brought into surface contact with a lower surface of a wafer 1 to hold the wafer 1 are mounted in a boat 60. The boat 60 is loaded in a processing chamber while the wafer 1 is charged in each of the multiple-stage wafer holders 70, and is unloaded after annealing of the wafer 1. When the wafer 1 is discharged from the multiple-stage wafer holders 70 of the boat 60, a wafer 1A is discharged from the wafer holder 70 in the uppermost stage region U of the boat, and then each wafer 1 is discharged toward the lowermost stage region B. Contaminations falling from the wafer 1 being discharged adhere to a lower side wafer 1, so that the adherence of the contaminations to the wafer holder on the lower side can be prevented, and accordingly the occurrence of an adverse effect, such as slip and warpage of the wafer 1, caused by the contaminations adhered to the wafer holders in the next time processing can be prevented beforehand. COPYRIGHT: (C)2011,JPO&INPIT