METHOD FOR CYLINDRICAL OR ARCUATE GRINDING OF SILICON INGOT

• Main Authors: TERAKUBO YOSHIHIRO, SAITO KOJI, YOSHIDA MINORU
• Format: Patent
• Language: English
• Published: 08.09.2011
• Subjects: AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CRYSTAL GROWTH; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METALLURGY; PERFORMING OPERATIONS; POLISHING; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE; REFINING BY ZONE-MELTING OF MATERIAL; SEMICONDUCTOR DEVICES; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE; SINGLE-CRYSTAL-GROWTH; TRANSPORTING; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL

PROBLEM TO BE SOLVED: To provide a method for cylindrical grinding capable of shortening time for cylindrical grinding of a material to be ground. SOLUTION: A cylindrical grinding device 1 is provided with a grinding wheel spindle 11a capable of moving back and forth for bearing a cup-wheel-shaped grindstone 11g and a grinding wheel spindle 11a capable of moving back and forth for bearing a cup-wheel-shaped grindstone 11g with a diameter smaller by 10-25 mm than that of the cup-wheel-shaped grindstone in such positions that the axis centers 11o of the grinding wheel spindles 11a and 11a are on the same line and the same line is at the right angle to a workpiece axis. The grinding device is used to cut a rotating cylindrical workpiece w bridged over clamping mechanisms 7a and 7b, and then while the rotating cylindrical workpiece w is horizontally moved, it is subjected to in-feed traverse cutting by the cup-wheel-shaped grindstones 11g and 11g. COPYRIGHT: (C)2011,JPO&INPIT