PHOTOSENSITIVE RESIN COMPOSITION AND SUBSTRATE FOR CIRCUIT FORMATION USING THE SAME

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is capable of forming a pattern having a low hygroscopic expansion coefficient and good solubility in a developer, and to provide a pattern forming method and a substrate for circuit formation using the photosensitive resin co...

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Bibliographic Details
Main Authors KAWASAKI MASARU, MINEGISHI TOMONORI, KONNO TAKU, NOKITA RIKA, SUZUKI KEIKO
Format Patent
LanguageEnglish
Published 25.08.2011
Subjects
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