PHOTOSENSITIVE RESIN COMPOSITION AND SUBSTRATE FOR CIRCUIT FORMATION USING THE SAME

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is capable of forming a pattern having a low hygroscopic expansion coefficient and good solubility in a developer, and to provide a pattern forming method and a substrate for circuit formation using the photosensitive resin co...

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Bibliographic Details
Main Authors KAWASAKI MASARU, MINEGISHI TOMONORI, KONNO TAKU, NOKITA RIKA, SUZUKI KEIKO
Format Patent
LanguageEnglish
Published 25.08.2011
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is capable of forming a pattern having a low hygroscopic expansion coefficient and good solubility in a developer, and to provide a pattern forming method and a substrate for circuit formation using the photosensitive resin composition. SOLUTION: The photosensitive resin composition includes (a) a polymer having a structural unit represented by formula (A), (b) a compound which generates a radical upon irradiation with actinic rays, and having a structure represented by formula (B), and (c) an arylsulfonamide derivative. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20100028672