PHOTOSENSITIVE RESIN COMPOSITION AND SUBSTRATE FOR CIRCUIT FORMATION USING THE SAME

• Main Authors: KAWASAKI MASARU, MINEGISHI TOMONORI, KONNO TAKU, NOKITA RIKA, SUZUKI KEIKO
• Format: Patent
• Language: English
• Published: 25.08.2011
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; INFORMATION STORAGE; INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is capable of forming a pattern having a low hygroscopic expansion coefficient and good solubility in a developer, and to provide a pattern forming method and a substrate for circuit formation using the photosensitive resin composition. SOLUTION: The photosensitive resin composition includes (a) a polymer having a structural unit represented by formula (A), (b) a compound which generates a radical upon irradiation with actinic rays, and having a structure represented by formula (B), and (c) an arylsulfonamide derivative. COPYRIGHT: (C)2011,JPO&INPIT