METHOD OF MANUFACTURING PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO WAVE CLOCK

• Main Author: FUNABIKI YOICHI
• Format: Patent
• Language: English
• Published: 18.08.2011
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method of manufacturing a package which can secure the continuity of the inside of the cavity and the outside, while maintaining airtightness inside a cavity, a piezoelectric vibrator, and to provide an oscillator, an electronic device and a radio wave clock. SOLUTION: The method of manufacturing the package includes: a first scanning process of scanning a first squeegee 45 in a +X direction along the outer surface 40a of a wafer 40 for a base substrate; a second scanning process of scanning a second squeegee 46 in a -X direction along the outer surface 40a; a wafer rotating process of separating the wafer 40 for the base substrate from a metal mask 80, rotating the wafer 40 for the base substrate around a center axis relative to the metal mask 80, and then closely attaching the outer surface 40a of the wafer 40 for the base substrate to the metal mask 80 again; a third scanning process of scanning the first squeegee 45 in a +Y direction along the outer surface 40a; and a fourth scanning process of scanning the second squeegee 46 in a -Y direction along the outer surface 40a. COPYRIGHT: (C)2011,JPO&INPIT