DRY FILM RESIST ROLL

• Main Author: IDE YOICHIRO
• Format: Patent
• Language: English
• Published: 04.08.2011
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a dry film resist roll which suppresses resist exudation and is excellent in adhesion and resolution, as a resist material such as an etching resist or a plating resist. SOLUTION: The dry film resist roll is prepared by providing a desiccant to edges of a film roll obtained by rolling up a dry film resist having a photosensitive layer, wherein the photosensitive layer comprises a photosensitive resin composition, the photosensitive resin composition comprises (a) 20-90 mass% of a binder resin having a carboxyl group content of 100-600 in terms of acid equivalent and a weight average molecular weight of 5,000-500,000, (b) 3-70 mass% of a photopolymerizable unsaturated compound, and (c) 0.1-20 mass% of a photopolymerization initiator, relative to the total amount of the composition, and the photosensitive layer has a melt viscosity at 70°C of 10,000-100,000 Pa sec. COPYRIGHT: (C)2011,JPO&INPIT