ADHESIVE COMPOSITION AND ADHESIVE SHEET USING THE SAME

PROBLEM TO BE SOLVED: To provide an adhesive composition satisfying both of high heat resistance and easy adhesiveness to an adherend. SOLUTION: The adhesive composition contains (A) an acrylic adhesive compound having a mass average molecular weight of ≥300,000, and an acid value of ≥1 and <5 mg...

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Bibliographic Details
Main Authors NAKAJIMA SATOSHI, FUKUHARA KUNIAKI
Format Patent
LanguageEnglish
Published 04.08.2011
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide an adhesive composition satisfying both of high heat resistance and easy adhesiveness to an adherend. SOLUTION: The adhesive composition contains (A) an acrylic adhesive compound having a mass average molecular weight of ≥300,000, and an acid value of ≥1 and <5 mg-KOH/g, (B) an acrylic adhesive compound having a mass average molecular weight of ≥3,000 and ≤(the mass average molecular weight of the combined component (A)+200,000), and an acid value of ≥30 and ≤200 mg-KOH/g, and (C) a specific crosslinking agent, wherein, the ratio of the formulated compounds (A) to (B), the modulus and the adhesive power within a temperature range of 23-260°C, the ratio (X)/(Y) of the modulus (X) at 23°C to the modulus (Y) at 260°C are present in specific ranges. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20100009535