ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING THE SAME

• Main Author: NAGANO YOJI
• Format: Patent
• Language: English
• Published: 28.07.2011
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an electronic apparatus in which an electronic component bonded on a substrate is sealed by a cap body, and to provide a method of manufacturing the same. SOLUTION: At a circumferential edge of a ceramic substrate 10 on another principal surface side, in which a vibrating piece bonding terminal 18 is provided, a stage part 11 is formed in parallel with the other principal surface. A wall surface 12 of a step formed by the stage part 11 and another principal surface is provided perpendicularly to the stage part 11. Furthermore, a metal layer 13 is provided over the stage part 11 and the wall surface 12. A piezoelectric vibrating piece 20 is bonded to the vibrating piece bonding terminal 18 through a bonding member 39. Then, the metal layer 13, over the stage part 11 and the wall surface 12 of the ceramic substrate 10, and a cap body 19, on a lower surface side of an abutting leg part 19c and on the inside of a side wall part 19b closer to the abutting leg part 19c, are bonded through brazing filler metal 29, and the piezoelectric vibrating piece 20 is air-tightly sealed within a cavity T surrounded with the cap body 19 and a bonding surface of the piezoelectric vibrating piece 20 of the ceramic substrate 10. COPYRIGHT: (C)2011,JPO&INPIT