PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE OF THE SAME

• Main Authors: HIMEDA YUKARI, IDE YOICHIRO
• Format: Patent
• Language: English
• Published: 14.07.2011
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; GENERAL PROCESSES OF COMPOUNDING; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has excellent resolution and adhesiveness as a resist material of an etching resist, a plating resist or the like. SOLUTION: The photosensitive resin composition contains 20-90 wt.% of (A) a binder polymer, 5-75 wt.% of (B) a photopolymerizable compound and 0.01-30 wt.% of (C) a photopolymerization initiator. The binder polymer (A) is a copolymer which is obtained by copolymerizing a first monomer being a carboxylic acid or a carboxylic acid anhydride and a second monomer having one polymerizable unsaturated group and being non-acidic, and has a weight average molecular weight of 5,000-100,000. The photopolymerizable compound (B) is an addition polymerizable monomer. A photosensitive resin layer, obtained by exposing and then developing the photosensitive resin composition, has a ≥60°contact angle to water, and a Young's modulus within the range of ≥1.5 GPa and <4 GPa. COPYRIGHT: (C)2011,JPO&INPIT