METHOD OF MANUFACTURING LED PACKAGE

• Main Authors: HAHM HUN JOO, PARK YOUNG SAM, HAN SEONG YEON, YOO CHUL HEE
• Format: Patent
• Language: English
• Published: 07.07.2011
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a mold tool that is manufactured by fluorocarbon resin to prevent a resin used as a material of a lens from adhering even if another deformed film is not used, and to provide a method of manufacturing an LED package using it. SOLUTION: In the lens mold tool for LED package, a cavity is formed to allow a resin which is a material of the LED package lens to be put, and an entire or a part thereof including an inner surface of the cavity is manufactured by fluorocarbon resin, thus preventing the resin to be put inside the cavity from adhering. The use of the lens mold tool for LED package and the method of manufacturing LED package using it has the advantage that a lens with smooth surface can be manufactured since a resin does not adhere even if another deformed film is not used and a pattern which sharply projects or is concave can be formed in a surface of a lens. COPYRIGHT: (C)2011,JPO&INPIT