METHOD OF BREAKING GATE OF RESIN-SEALED SEMICONDUCTOR DEVICE, AND RESIN-SEALED DEVICE

PROBLEM TO BE SOLVED: To restrain dispersion of a gate residual amount in cutting a runner part. SOLUTION: A runner part 20 of a package material 70 is sandwiched between a butterfly plate 12 and a butterfly plate 13, and dummy resin-sealed parts 3 of the package material 70 are pressed down by a pr...

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Bibliographic Details
Main Authors NAGIRA TADASHI, OHATA TATSUYA, KOGA MINEO
Format Patent
LanguageEnglish
Published 30.06.2011
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:PROBLEM TO BE SOLVED: To restrain dispersion of a gate residual amount in cutting a runner part. SOLUTION: A runner part 20 of a package material 70 is sandwiched between a butterfly plate 12 and a butterfly plate 13, and dummy resin-sealed parts 3 of the package material 70 are pressed down by a predetermined amount by the butterfly plate 11. Thereafter, the butterfly plates 12 and 13 or the butterfly plate 11 are/is moved, and thereby the runner part 20 of the package material 70 is subjected to gate breaking. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090288767