METHOD OF MANUFACTURING LAMINATED WIRING BOARD

PROBLEM TO BE SOLVED: To solve such a problem wherein the formation of fine irregularities for increasing adhesion strength causes a disadvantage to capacitor characteristics and reliability when a wiring layer of a laminated wiring board is utilized as a capacitor lower electrode. SOLUTION: In the...

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Bibliographic Details
Main Authors YANAGAWA SHUSAKU, MATSUMOTO KAZUHARU, OKA SHUICHI, HORIUCHI SATOSHI
Format Patent
LanguageEnglish
Published 30.06.2011
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To solve such a problem wherein the formation of fine irregularities for increasing adhesion strength causes a disadvantage to capacitor characteristics and reliability when a wiring layer of a laminated wiring board is utilized as a capacitor lower electrode. SOLUTION: In the method of manufacturing a laminated wiring board, an MIM structure covering a part of a wiring layer (14) is formed, and fine irregularities are formed on a wiring layer surface not being covered therewith. An insulating substrate 19a is stuck on the fine irregularities, and an opening is formed in the insulating substrate 19a in a capacitive element part to form electrode extraction wiring (24) of a capacitive element in the opening. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090286029