ADHESIVE TAPE FOR RESIN-ENCAPSULATING AND METHOD OF MANUFACTURE OF RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME

• Main Authors: HOSHINO KUNIFUMI, YANAGI YUICHIRO, SHIMOKAWA DAISUKE, KONDO HIROYUKI
• Format: Patent
• Language: English
• Published: 23.06.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PROBLEM TO BE SOLVED: To provide an adhesive tape for resin-encapsulating for efficiently preventing resin leakage during a resin encapsulating operation, and also to provide a method of manufacture of a resin-encapsulated semiconductor device using the adhesive tape. SOLUTION: The adhesive tape 20 for resin-encapsulating used in a method of manufacture of a resin-encapsulated semiconductor device, has a base material layer and an adhesive agent layer laminated on the base material layer, and a total film thickness of the base material layer and the adhesive agent layer are 25 to 40 μm. The method of manufacture of the resin-encapsulated semiconductor device includes processes of: allowing the adhesive tape 20 to adhere onto at least one surface of a lead frame 11; mounting a semiconductor chip 15 on the lead frame 11; encapsulating the side of the semiconductor chip 15 with the use of an encapsulating resin 17; and releasing the adhesive tape 20 after the encapsulation. COPYRIGHT: (C)2011,JPO&INPIT