OPERATION PROCESSING DEVICE OR METHOD FOR INSPECTING STICKING STATE OF ACF, OR LINE OR METHOD FOR ASSEMBLING DISPLAY SUBSTRATE MODULE

PROBLEM TO BE SOLVED: To provide a processing operation device or a method for inspecting a sticking state of an ACF, capable of reducing the total operation time of a processing operation for sticking the ACF and an inspection operation of the sticking state of the ACF, or capable of reducing a pro...

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Bibliographic Details
Main Authors AKIBA YUJI, TAKEDA MASAOMI, KATAHO HIDEAKI, HISA TAKAFUMI, EBISAWA KEIICHI, TAMAMOTO JUNICHI, SAITO YOSHIHIRO, DOI HIDEAKI
Format Patent
LanguageEnglish
Published 23.06.2011
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Summary:PROBLEM TO BE SOLVED: To provide a processing operation device or a method for inspecting a sticking state of an ACF, capable of reducing the total operation time of a processing operation for sticking the ACF and an inspection operation of the sticking state of the ACF, or capable of reducing a processing operation device length required for sticking the ACF, or to provide a line and method for assembling a display substrate module, capable of reducing a cycle time for assembling the display substrate module or achieving reduced line length. SOLUTION: When an ACF 3 stuck on a predetermined position of a side of a display substrate P conveyed by a conveyance unit is imaged to inspect a sticking state of an ACF, the display substrate P is imaged during conveyance after sticking the ACF 3, fluctuation in an ACF image obtained by imaging during the conveyance is corrected, and an imaging unit images an imaging region SH including the ACF 3 stuck on the predetermined position. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090280944