HIGH-DENSITY PLASMA STRIPPER

• Main Authors: TOKUNAGA YUKINOBU, GOTO NAOKI, FUJIYAMA HIROSHI, TATSUISHI KENJI, IWAMOTO NAOHISA, NISHIYAMA SHINICHIRO
• Format: Patent
• Language: English
• Published: 16.06.2011
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS

PROBLEM TO BE SOLVED: To provide a high-density plasma stripper reducing an environmental load and enabling a high-speed surface treatment of a treated wire using a high-density plasma applicable to a wide range of operating pressure from a low pressure to a high pressure. SOLUTION: The high-density plasma stripper includes: a chamber 42 into which operating gas is introduced; the treated wire 43 arranged inside the chamber and transferred through the chamber; a plurality of conductors 44 (44A-44C) arranged so as to surround the treated wire inside the chamber and coated with each dielectric; an AC power supply applying a high-voltage low-frequency voltage or a high-voltage three-phase AC voltage of the same potential to each of the plurality of conductors; and a DC bias power supply applying a negative DC bias voltage to the treated wire. The surface treatment of the treated wire 44 is performed using a complex plasma generated around the treated wire 43, the complex plasma being a combination of a DC discharge between the chamber and the treated wire and a dielectric barrier discharge between the treated wire and the plurality of conductors. COPYRIGHT: (C)2011,JPO&INPIT