DEVICE AND METHOD FOR FILLING LITHOGRAPHY COMPOSITION

PROBLEM TO BE SOLVED: To provide a device and method for filling a lithography composition, wherein contamination mixture is reduced by suppressing a flow rate variation and a pressure variation before and after a filter owing to by the opening/closing operation of a filling valve or the like. SOLUT...

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Bibliographic Details
Main Authors YAMAZAKI AI, KANAYAMA TAIZO, CHIHARA MICHIHIRO
Format Patent
LanguageEnglish
Published 09.06.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a device and method for filling a lithography composition, wherein contamination mixture is reduced by suppressing a flow rate variation and a pressure variation before and after a filter owing to by the opening/closing operation of a filling valve or the like. SOLUTION: In the method of filling the lithography composition, the lithography composition discharged from a supply means which supplies the lithography composition is fed via a flow path, the lithography composition is filtered via a filtering means provided in the flow path and provided with a filter for filtering the lithography composition, and the lithography composition is filled in a container 13 via a plurality of filling means provided on the downstream of the flow path. The total filling flow rate from filling nozzles 14 of the plurality of filling means is adjusted and the lithography composition is filled in the container 13. Each filling means is provided with a valve 7 for adjusting the filling flow rate, and the total filling flow rate is adjusted to be within a predetermined range by adjusting the opening degree of the valve 7. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090267516