ONE-PACK EPOXY RESIN COMPOSITION AND APPLICATION THEREOF

• Main Authors: FUKUHARA TOMOHIRO, NAKAJIMA SEIJI, OTANI OSAMU
• Format: Patent
• Language: English
• Published: 09.06.2011
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To realize a one-pack epoxy resin composition for which a variety of types of curing agents can be used and which is suppressed in the occurrence of separation between an epoxy resin and a curing agent even when used in a gap of about several tens of micrometers. SOLUTION: The epoxy resin composition of this invention relates to a one-pack epoxy resin composition for hermetically sealing electronic components or electrical components and comprises a liquid epoxy resin, dicyandiamide, and a filler, wherein the average particle diameter of the filler is in the range of 0.1-1 μm, the proportion of particles of particle diameters of 5 μm or larger to the entire filler is 20 wt.% or smaller, and the content of the filler is in the range of 5-60 pts.wt. based on 100 pts.wt. the epoxy resin. COPYRIGHT: (C)2011,JPO&INPIT