TERMINAL STRUCTURE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING THE SAME

• Main Authors: AOKI TOMOYUKI, YAJIMA HIROYUKI, HAMAYA TOSHIJI, ADACHI HIROKI
• Format: Patent
• Language: English
• Published: 02.06.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PROBLEM TO BE SOLVED: To provide a method of manufacturing a terminal having a conductor passing through a set prepreg, and also a method of manufacturing an electronic device having the terminal. SOLUTION: A prepreg has at least one opening. The prepreg is bonded on a substrate having an electronic element formed thereon so that a conductor forming a terminal is overlapped with the opening of the prepreg. Conductive paste is provided in a region of the prepreg where the opening is formed. The conductive paste partly flows into the opening, whereby the terminal is connected to the conductor. Then the resultant substrate is subjected to heating treatment to set the conductive paste and the prepreg. In the course of forming the terminal, the need of carrying out a step of forming the opening with a laser beam after the prepreg is set can be eliminated. Thus, the influence of the laser beam on the electronic element can be eliminated. COPYRIGHT: (C)2011,JPO&INPIT