CIRCUIT CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

• Main Authors: MOCHIZUKI AKIOMI, ARIFUKU MASAHIRO, KOBAYASHI KOJI, KOJIMA KAZUYOSHI
• Format: Patent
• Language: English
• Published: 06.05.2011
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; CURRENT COLLECTORS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; LINE CONNECTORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a circuit connecting material capable of attaining good electrical connection between countering circuit electrodes. SOLUTION: The circuit connecting material 10 for connection of the circuit members is for electrical connection of the two circuit members 30, 40 with circuit electrodes 32, 42 formed on the same and with the circuit electrodes arranged in countering positions. The circuit connecting material contains an adhesive composition 11 and conductive particles 12. The conductive particles include a core consisting of an organic polymer compound covered with a metal layer made of nickel or a nickel alloy with a plurality of protrusions 14 on a surface of the same. An average particle diameter of the core is 1 to 4 μm, a thickness of the metal layer is 65 to 125 nm, and a thickness of the circuit electrode is 50 nm or more. COPYRIGHT: (C)2011,JPO&INPIT