STEP PORTION COVERING MATERIAL AND STRUCTURE FOR LAYING FLOORING MATERIAL BY USING THE SAME

PROBLEM TO BE SOLVED: To provide a step portion covering material capable of shortening a construction time by eliminating a malfunction when a flooring material is laid on a sub-floor with a step portion, and a structure for laying the flooring material by using the covering material. SOLUTION: Thi...

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Bibliographic Details
Main Authors SHISHIDO JUNICHI, NISHIOKA JUNICHI
Format Patent
LanguageEnglish
Published 06.05.2011
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Summary:PROBLEM TO BE SOLVED: To provide a step portion covering material capable of shortening a construction time by eliminating a malfunction when a flooring material is laid on a sub-floor with a step portion, and a structure for laying the flooring material by using the covering material. SOLUTION: This step portion covering material 4 is equipped with a strip-shaped covering portion 4a for covering the step portion 3 of the sub-floor 10 together with high and low step portions 1a and 1b on both sides thereof; and a recessed groove 4b for bend is provided in the covering portion. In the structure for laying the flooring material, the step portion covering material 4 is installed between the step portion 3 of the sub-floor 10 and the flooring material 2 laid on the sub-floor; the step portion 3 is covered with the strip-shaped covering portion 4a together with the high and low step portions 1a and 1b on both the sides thereof. The gap between the strip-shaped covering portion 4a and the step portion 3 is filled with a filler 5. The step portion 3 and the portions on both the sides thereof are covered with the strip-shaped covering portion 4a to prevent a shape of the step portion 3 from being reflected on the flooring material 2 and inhibit a deterioration in construction finish. A hole and the like are not opened in the flooring material 2; and the operation of laying the flooring material 2 can be operated before the completion of reaction of a filler 5, to shorten the construction time. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090241028