RESIN COMPOSITION SET

• Main Authors: CHIKUNO SHINGO, SAWA KIYOTAKA
• Format: Patent
• Language: English
• Published: 28.04.2011
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a resin set which can easily regulate cure time of a moisture curable polymer such as a condensation silicone resin. SOLUTION: The moisture cured resin composition set comprises a combination of an agent A containing :a component (A-1): OH group-containing a polysiloxane or a moisture curable polymer having a functional group, which can be condensed by moisture, in a terminal; a component (A-2): an organosilicon crosslinking agent; a component (A-3): a silicon compound which can cure the following component (B-2), and an agent B containing: a component (B-1): an OH group-containing polysiloxane or a moisture curable polymer having a functional group, which can be condensed by moisture, in a terminal; a component (B-2): an epoxy terminal or (meth)acrylic terminal polymer; and a component (B-3): a condensation cure catalyst. COPYRIGHT: (C)2011,JPO&INPIT