FILM LIKE ADHESIVE

PROBLEM TO BE SOLVED: To provide a film like adhesive used in a back grind process, dicing process and flip chip-bonding process of a semiconductor wafer and excellent in the peeling property of a back grind tape and wafer protecting property. SOLUTION: This film like adhesive is provided by laminat...

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Bibliographic Details
Main Authors OKUBO KEISUKE, IKETANI TAKUJI, NAGAI AKIRA
Format Patent
LanguageEnglish
Published 14.04.2011
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide a film like adhesive used in a back grind process, dicing process and flip chip-bonding process of a semiconductor wafer and excellent in the peeling property of a back grind tape and wafer protecting property. SOLUTION: This film like adhesive is provided by laminating an adhesive layer, a thermosetting resin layer and a second plastic layer on a first plastic layer in this order, and having ≤50 N/m peeling force at 90° peeling test between the adhesive layer and thermosetting resin layer at any of 300 mm/min and 500 mm/min peeling speeds. COPYRIGHT: (C)2011,JPO&INPIT
Bibliography:Application Number: JP20090227771