METHOD OF MANUFACTURING PRODUCT TO BE SOLDER-BONDED, SOLDER BONDING DEVICE, SOLDER CONDITION DETERMINATION METHOD, REFLOW DEVICE AND SOLDER BONDING METHOD

• Main Authors: TAKADA MICHIAKI, ISHIKAWA TETSUJI, KOJIMA MITSUMASA, SAITO OSAMU
• Format: Patent
• Language: English
• Published: 07.04.2011
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To readily determine most suitable reflow conditions when solder-bonding a product to be solder-bonded by reflow heating. SOLUTION: This method of manufacturing the product to be solder-bonded is for solder-bonding components onto a substrate by reflow heating of the substrate on which the components to be mounted are placed based on a predetermined heating condition. In the method, component volumes occupied with the components mounted within a range of a predetermined size in each position of the substrate occupies are calculated, respectively, heating conditions are determined according to the calculated component volumes, and reflow heating is performed based on the determined heating conditions. COPYRIGHT: (C)2011,JPO&INPIT